| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor element housing package which has low transmission loss, facilitates impedance adjustment, is not easily affected by an electromagnetic field, and is easy to manufacture. <P>SOLUTION: In a semiconductor element housing package 10 which includes a base substrate 11 and a frame body 12 and is for housing a semiconductor element, the package 10 includes two L-shaped lead terminals 25 for signals and for the ground or three of them for signals and for the ground on both sides, and a dielectric substrate 26 provided with wiring conductors 19f and 19g for connecting them on one main surface and provided with a ground plane 21a connected through the wiring conductor 19g for the ground and a conductor via 20a for connection on the other, a unit 27 for connecting the lead terminals 25 to it is provided by connecting the ground plane 21a to the frame body 12 and/or a feed-through substrate 24, and one end of the lead terminals 25 of the unit 27 is connected to the feed-through substrate 24. <P>COPYRIGHT: (C)2013,JPO&INPIT |
