| 摘要 |
FIELD: chemistry.SUBSTANCE: method of producing a sealed electronic module involves forming a housing with a vertical protrusion on the outer perimetre of the upper surface of the side walls of the housing, placing electronic components inside the housing, placing a cover on the housing, fixing said cover to the housing with screws, filling the working clearance between the cover and the housing with an epoxy resin-based adhesive composition and drying the module until the adhesive composition completely solidifies. The method involves formation of a cover with a bevel edge on the perimetre of the outer upper side and dimensions which enable the end face of the cover before the surface of the bevel edge to rest on the inner surface of the vertical protrusion with formation of a working clearance between the surface of the bevel edge and the inner surface of the vertical protrusion. After solidification of the adhesive composition, the surface of the solid adhesive composition is covered with a sublayer consisting of a mixture of polybutyl titanate, ethyl silicate-32 and white spirit, with the following ratio of components, pts.wt: polybutyl titanate 36-40, ethyl silicate-32 202-206, white spirit 756-760; and then held until complete evaporation of white spirit. The working clearance is then filled with an organosilicon sealant and dried until complete polymerisation thereof, wherein the epoxy resin-based adhesive composition contains modified K-139 epoxy resin, UP-0633M amine curing agent, boron nitride and chromium (III) oxide, with the following ratio of components, pts.wt: modified epoxy resin 594-596, amine curing agent 88-90, BN 296-300, CrO16-20.EFFECT: sealed electronic module housing is obtained, which is suitable for protecting on-board radio electronic equipment from the destabilising effect of the environment for a long period of time.2 cl, 2 dwg, 1 tbl |
