DEVICE FOR SOLDERING IN CONTROLLED ATMOSPHERE

摘要

FIELD: process engineering.SUBSTANCE: invention relates to machine building and may be used for soldering articles from special steels and active materials. Proposed device comprises heating kiln and evacuated container arranged there inside. Evacuation system and protective gas feed system are communicated with said container. Said container houses extra container to accommodate auricle to be soldered. Evacuated container comprises plate with closed channel. Said channel is filled up with minced getter. Protective gas feed system is provided with several channels. Said channels may be communicated with evacuated container. Channels are communicated with vessels. Said vessels contain inert or active gases. Evacuated container comprises getter and open vessel. Active material evaporates in said vessel at soldering temperature. Extra container accommodated open vessel with material evaporating at increased temperature. Evacuated container comprises valve. Said valve serves to maintain preset gas pressure.EFFECT: higher efficiency.6 cl, 1 dwg