CMP POLISHING FLUID, METHOD FOR MANUFACTURING THE SAME, METHOD FOR MANUFACTURING COMPOSITE PARTICLE, AND METHOD FOR POLISHING BASE MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a CMP polishing fluid which can improve polishing speed for an insulator film.

SOLUTION: This CMP polishing fluid contains water and abrasive particles. The abrasive particles contain composite particles having a core, which includes a first particle, and a second particle provided on that core. The first particle contains silica, and the second particle contains cerium hydroxide. The pH of the CMP polishing fluid is 9.5 or less.

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