| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure device and an exposure method that can reduce warpage of a substrate W conveyed from a work loader to a substrate stage to enable the substrate to be mounted on a work chuck. <P>SOLUTION: A work chuck 31 of a substrate stage 11 is provided with a plurality of adsorbing pins 70 that can advance from the surface of the work chuck 31, the adsorbing pins 70 being provided linearly in a plurality of columns. A controller 4 controls whether the respective adsorbing pins 70 adsorb or not when the substrate stage 11 receives a substrate W from a work loader 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
