发明名称 |
METHODS FOR FORMING FEEDTHROUGHS FOR HERMETICALLY SEALED HOUSINGS USING POWDER INJECTION MOLDING |
摘要 |
Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies. |
申请公布号 |
US2012306128(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
US201013512115 |
申请日期 |
2010.11.26 |
申请人 |
PARKER JOHN L.;ROBINSON DAVID;THOMAS DAVID;FRETZ MARK;NATIONAL ICT AUSTRALIA LIMITED |
发明人 |
PARKER JOHN L.;ROBINSON DAVID;THOMAS DAVID;FRETZ MARK |
分类号 |
C04B35/64 |
主分类号 |
C04B35/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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