发明名称 METHODS FOR FORMING FEEDTHROUGHS FOR HERMETICALLY SEALED HOUSINGS USING POWDER INJECTION MOLDING
摘要 Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.
申请公布号 US2012306128(A1) 申请公布日期 2012.12.06
申请号 US201013512115 申请日期 2010.11.26
申请人 PARKER JOHN L.;ROBINSON DAVID;THOMAS DAVID;FRETZ MARK;NATIONAL ICT AUSTRALIA LIMITED 发明人 PARKER JOHN L.;ROBINSON DAVID;THOMAS DAVID;FRETZ MARK
分类号 C04B35/64 主分类号 C04B35/64
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