发明名称 |
Packaging Structures and Methods |
摘要 |
A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier. |
申请公布号 |
US2012306080(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
US201113298046 |
申请日期 |
2011.11.16 |
申请人 |
YU CHEN-HUA;JENG SHIN-PUU;HOU SHANG-YUN;HSU KUO-CHING;HSIEH CHENG-CHIEH;SHIH YING-CHING;TSAI PO-HAO;HUANG CHENG-LIN;LIN JING-CHENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHEN-HUA;JENG SHIN-PUU;HOU SHANG-YUN;HSU KUO-CHING;HSIEH CHENG-CHIEH;SHIH YING-CHING;TSAI PO-HAO;HUANG CHENG-LIN;LIN JING-CHENG |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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