| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is excellent in stress relaxation and a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device includes: a lead frame 1; a semiconductor element 3 mounting on a die pad part 1B of the lead frame 1; a protection film 5 covering at least a part of the semiconductor element 3; and a sealing resin 6 sealing the semiconductor element 3 and the protection film 5. At least one gap layer 7, in which the protection film 5 does not closely contact with the sealing resin 6, exists between the protection film 5 and the sealing resin 6. <P>COPYRIGHT: (C)2013,JPO&INPIT |
