| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a system and a method for a three-axis sensor chip package. <P>SOLUTION: A sensor package comprises: a base 105; a first sensor die 110 having a first active sensor circuit 112 and a plurality of metal pads 114 electrically coupled to the first active sensor circuit; a second sensor die 120 mounted to the base, the second sensor die having a second active sensor circuit 122 arranged on a first surface 128, and a second plurality of metal pads 124 electrically coupled to the second active sensor circuit arranged on a second surface. The second sensor die is arranged such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit and is perpendicular to the base. The second surface is adjacent to the first surface and angled with respect to a plane of the first surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
