发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method of manufacturing a MOSFET includes the steps of preparing a silicon carbide substrate, forming an active layer on the silicon carbide substrate, forming a gate oxide film on the active layer, forming a gate electrode on the gate oxide film, forming a source contact electrode on the active layer, and forming a source interconnection on the source contact electrode. The step of forming the source interconnection includes the steps of forming a conductor film on the source contact electrode and processing the conductor film by etching the conductor film with reactive ion etching. Then, the method of manufacturing a MOSFET further includes the step of performing annealing of heating the silicon carbide substrate to a temperature not lower than 50° C. after the step of processing the conductor film.
申请公布号 US2012309174(A1) 申请公布日期 2012.12.06
申请号 US201113577836 申请日期 2011.12.07
申请人 HIYOSHI TORU;MASUDA TAKEYOSHI;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 HIYOSHI TORU;MASUDA TAKEYOSHI
分类号 H01L21/20 主分类号 H01L21/20
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