| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor module having both high heat radiation and high insulation between a die pad and a heat sink. <P>SOLUTION: A recess is formed on the lower surface side of a mold layer 60. On the bottom surface of the recess, the lower surface of a die pad 30, or the like, is exposed. On the bottom surface, a salient 61 protruding to the lower side than a plane constituting the lower surface of the die pad is configured between neighboring die pads. Four apexes of the salient 61 are formed to configure an identical plane. In the recess on the lower surface side of the mold layer 60, a heat sink 80 is bonded through an insulation layer 70. The upper surface of the heat sink 80 is supported by the four apexes of the salient 61. Each interval between the heat sink 80 and the die pads 10, 20, 30, 40 and 50 is determined by the salient 61. The gap is filled with the insulation layer 70. <P>COPYRIGHT: (C)2013,JPO&INPIT |
