发明名称 |
Interposer Test Structures and Methods |
摘要 |
An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads. |
申请公布号 |
US2012305916(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
US201113198223 |
申请日期 |
2011.08.04 |
申请人 |
LIU TZUAN-HORNG;YU CHEN-HUA;HU HSIEN-PIN;WANG TZU-YU;WU WEI-CHENG;HOU SHANG-YUN;JENG SHIN-PUU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIU TZUAN-HORNG;YU CHEN-HUA;HU HSIEN-PIN;WANG TZU-YU;WU WEI-CHENG;HOU SHANG-YUN;JENG SHIN-PUU |
分类号 |
H01L23/528 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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