发明名称 Interposer Test Structures and Methods
摘要 An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads.
申请公布号 US2012305916(A1) 申请公布日期 2012.12.06
申请号 US201113198223 申请日期 2011.08.04
申请人 LIU TZUAN-HORNG;YU CHEN-HUA;HU HSIEN-PIN;WANG TZU-YU;WU WEI-CHENG;HOU SHANG-YUN;JENG SHIN-PUU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIU TZUAN-HORNG;YU CHEN-HUA;HU HSIEN-PIN;WANG TZU-YU;WU WEI-CHENG;HOU SHANG-YUN;JENG SHIN-PUU
分类号 H01L23/528 主分类号 H01L23/528
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