APPLICATION PROCESSING APPARATUS, APPLICATION DEVELOPMENT PROCESSING SYSTEM, AND RECORD MEDIUM RECORDING APPLICATION PROCESSING METHOD AND PROGRAM FOR EXECUTING APPLICATION PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an application processing apparatus which controls the film thickness at any position on a substrate surface and reduces the variations in the film thickness on the substrate surface when a coating liquid is applied by a spin coating method to form a flim.

SOLUTION: An application processing apparatus 23 supplies a coating liquid to a rotating substrate surface and diffuses the supplied coating liquid to the outer peripheral side of the substrate, thereby applying the coating liquid on the substrate surface. The application processing apparatus 23 has: a substrate holding part 31 holding the substrate; a rotation part 32 rotating the substrate held by the substrate holding part 31; a supply part 43 supplying the coating liquid on the surface of the substrate held by the substrate holding part 31; and an air flow control plate 63 provided at a predetermined position located above the substrate held by the substrate holding part 31 and locally changing the air flow above the substrate rotated by the rotation part 32 at any position.

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