| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting light reflecting resin composition high in reflectivity of light from visible light to near-ultraviolet light, and excellent in resistance to thermal deterioration and tablet moldability, after it is cured, and hard to cause burrs during transfer molding, a method of manufacturing the same, and an optical semiconductor mounting substrate and an optical semiconductor device using the resin composition. <P>SOLUTION: This thermosetting light reflecting resin composition 110 contains a thermosetting component and a white pigment, and the length of the burr produced when transfer-molding the resin under a condition of a molding temperature of 100°C-200°C, molding pressure of 20 MPa or less, and a molding time of 60-120 sec. is 5 mm or shorter, and light reflectivity at a wavelength of 350 nm-800 nm is 80% or higher after the resin is thermally cured. The optical semiconductor element mounting substrate and the optical semiconductor device are formed by preparing and using the thermosetting light reflecting resin composition 110. <P>COPYRIGHT: (C)2013,JPO&INPIT |
