| 摘要 |
PURPOSE: A heat radiation substrate for an LED is provided to smoothly transmit heat from the LED to a heat sink by including a vertical insulation layer which is vertically extended on a metal board. CONSTITUTION: A metal board(200) includes a laminate structure of heterogeneous metal. An insulation pattern(240) is formed on both sides of an LED loading region. A conductive pattern(250) is formed on the upper side of the insulation pattern. A vertical insulation layer(230) is vertically extended in the metal board. A thermal pad(260) performs a thermal bonding and an LED(400) and a metal board.
|
