发明名称 |
Gap mapping for fitting composite doublers |
摘要 |
A non-conductive composite doubler is fabricated for application to an electrically conductive surface of a structure by: forming the composite doubler; placing an array of capacitive gap thickness sensors between the doubler and the structure surface; measuring the gap thickness between the doubler and the structure surface in a plurality of areas over the surface of the structure; using the gap thickness measurements to shape a layer of adhesive to essentially match the contour of the structure surface; and, applying the layer of adhesive to the doubler. |
申请公布号 |
US8324911(B2) |
申请公布日期 |
2012.12.04 |
申请号 |
US20070957767 |
申请日期 |
2007.12.17 |
申请人 |
GEORGESON GARY E.;EVENS MICHAEL W.;FOGARTY MICHAEL D.;SAFAI MORTEZA;THE BOEING COMPANY |
发明人 |
GEORGESON GARY E.;EVENS MICHAEL W.;FOGARTY MICHAEL D.;SAFAI MORTEZA |
分类号 |
G01R27/26 |
主分类号 |
G01R27/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|