发明名称 Gap mapping for fitting composite doublers
摘要 A non-conductive composite doubler is fabricated for application to an electrically conductive surface of a structure by: forming the composite doubler; placing an array of capacitive gap thickness sensors between the doubler and the structure surface; measuring the gap thickness between the doubler and the structure surface in a plurality of areas over the surface of the structure; using the gap thickness measurements to shape a layer of adhesive to essentially match the contour of the structure surface; and, applying the layer of adhesive to the doubler.
申请公布号 US8324911(B2) 申请公布日期 2012.12.04
申请号 US20070957767 申请日期 2007.12.17
申请人 GEORGESON GARY E.;EVENS MICHAEL W.;FOGARTY MICHAEL D.;SAFAI MORTEZA;THE BOEING COMPANY 发明人 GEORGESON GARY E.;EVENS MICHAEL W.;FOGARTY MICHAEL D.;SAFAI MORTEZA
分类号 G01R27/26 主分类号 G01R27/26
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