Method on Production Base Free PCB of High Heat Conduction, Base Free PCB, Heat Emission Module Using Base Free PCB, LED Lighting Module Using Heat Emission Module

摘要

PURPOSE: A high thermal conductive base free printed circuit board, a manufacturing method thereof, a heat dissipation module using the printed circuit board and an LED lighting module using the heat dissipation module are provided to manufacture a high thermal conductive PCB with improved heat dissipation efficiency of an electronic component. CONSTITUTION: A solder resist cover lay and a metal thin film are bonded(S1-3). A developed film is laminated on the bottom side of the metal thin film(S1-4). A reverse direction exposure of an electronic circuit is performed on the developed film(S1-5). The reverse direction electronic circuit pattern is formed on the developed film. The developed film is developed(S1-6). The metal thin film is etched(S1-7). [Reference numerals] (S1-1) Stiffened plate integrated solder resist cover lay preparation; (S1-10) Front acid rinse and drying; (S1-11) Organic Solderability Preservatives formation or planting; (S1-12) Selective insulated ink application(PSR: Photo Solder Resist); (S1-2) Stiffened plate integrated solder resist cover lay solder land hole processing; (S1-3) Stiffened plate integrated solder resist cover lay attachment on a metal thin film for an electronic circuit pattern; (S1-4) Photoresist film laminating and carrier film attachment; (S1-5) Reverse circuit pattern exposure; (S1-6) Developing; (S1-7) Etching; (S1-8) Strip; (S1-9) Carrier film removal