| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation substrate applicable to an LED package. <P>SOLUTION: A heat dissipation substrate is made of a metal material, and comprises: a printed circuit board on which a light-emitting element is mounted; a heat dissipation plate provided at a bottom of the printed circuit board and releasing heat transmitted from the light-emitting element to the printed circuit board to the outside; and a heat dissipation layer formed at a side face of the printed circuit board and releasing the heat transmitted to the printed circuit board to the outside via the side face of the printed circuit board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
