发明名称 LIQUID RESIN SUPPLY MECHANISM, AND COMPRESSION MOLDING DEVICE EQUIPPED WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a new liquid resin supply mechanism that can supply a constant amount of liquid resin to a mold with high reproducibility by properly processing stringing resin. <P>SOLUTION: The liquid resin supply mechanism 1 discharges the liquid resin 200 downward from a nozzle 2 with a built-in gate valve 5, and supplies the liquid resin 200 to one of the molds. An outer peripheral air blowing port 3 for blowing air toward a nozzle tip end at the lower side is arranged at the outer periphery of the nozzle 2. A gate valve 5 is opened and the liquid resin 200 is discharged by a control signal from a control circuit 9. When finishing the discharge of the liquid resin 200, the gate valve 5 is closed and the control for blowing the air at the predetermined temperature from the outer peripheral air blowing port 3 is performed to maintain the liquid resin 200 in a liquid state. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012232437(A) 申请公布日期 2012.11.29
申请号 JP20110101188 申请日期 2011.04.28
申请人 SODICK CO LTD 发明人 FUJIKAWA MISAO
分类号 B29C31/04;B29C39/22 主分类号 B29C31/04
代理机构 代理人
主权项
地址