ELECTRONIC DEVICE HAVING A CHIP AND METHOD FOR MANUFACTURING BY COILS.

摘要

The invention relates to an electronic device (0) having a chip comprising at least one flexible supporting film (3) in which the top surface has a top contact pad (5) and in which the bottom surface has at least one bottom contact pad (7), each contact pad being interconnected (4) through the supporting film (3) such that at least one bottom contact pad (7) is connected to the top contact pad (5), the bottom contact pad or pads (7) being offset relative to the area opposite the top contact pad (5). A thick film (9) provided with at least one cavity (8) is attached to at least one portion of the surface of the supporting film (3). The invention also relates to the method and machine for manufacturing the device (0).