| 摘要 |
PURPOSE: An apparatus for re-balling a solder ball is provided to shorten rework time by attaching solder balls, which are mounted on plural devices, to a device pad and by using a jig at the same time. CONSTITUTION: A jig(200) is mounted on a base table(100). A stencil(300) for flux coating includes plural flux through holes. The flux is applied on the pad of device through the flux through holes. A stencil for mounting a solder ball comprises plural solder ball through holes. The solder ball through holes mount solder balls on the pad coated with the flux.
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