发明名称 Mold apparatus
摘要 The present disclosure relates to a mold apparatus, and according to an aspect of the present disclosure, there is provided a mold apparatus including a cavity mold comprising a cavity mold plate (110) formed with a cavity (120) at a front surface (110a) thereof and provided with a heating means (111) at an inner portion thereof, and a cooling plate (130) brought into contact with or separated from a rear surface (110b) of the cavity mold plate and provided with a cooling means (131) at an inner portion thereof; and a core mold (200) configured to determine the cavity together with the cavity mold plate, wherein the cooling plate is formed with at least two or more divided surfaces (130a, 130b, 130c, 130d, 130e, 130f).
申请公布号 EP2527125(A2) 申请公布日期 2012.11.28
申请号 EP20120004040 申请日期 2012.05.24
申请人 LG ELECTRONICS INC. 发明人 KIM, JOOKWON;LEE, GYUSANG;HWANG, MINKYU;JUN, HYUNWOO;JEONG, SEOKJAE;KIM, KYUNGDO
分类号 B29C45/73 主分类号 B29C45/73
代理机构 代理人
主权项
地址