| 摘要 |
<p>PURPOSE: A light-emitting diode package and a manufacturing method thereof are provided to prevent the deterioration of a fluorescent material layer by forming a LED diode in the pillar part of a PCB. CONSTITUTION: A light emitting diode(130) is mounted on a printed circuit board. A pillar part(120) is formed next to the light emitting diode. The height of the pillar part is higher than that of the light emitting diode. A transmission part(150) transmits light emitted from the light emitting diode. A conformal material for changing the wave length of light is coated on the fluorescent material layer(140).</p> |
