MULTI-LAYER WIRING BOARD, IC PACKAGE, AND METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD

摘要

A multi-layer circuit wiring board comprising a laminate of films (131a, 131b, 131c), each film having a wiring pattern (17a, 17b, 21, 23) formed on at least one surface thereof, wherein the wiring pattern formed on each film is electrically connected with the wiring pattern (17a, 17b, 21, 23) formed on another film (131a, 131b, 131c) which is disposed neighboring thereto through a via-contact layer (19a, 19b) provided on any one of the neighboring films.