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发明名称
COMPACTION OF MULTILAYER WIRING FOR INTEGRATED CIRCUIT
摘要
申请公布号
JPH02303144(A)
申请公布日期
1990.12.17
申请号
JP19890125690
申请日期
1989.05.18
申请人
ROHM CO LTD
发明人
TAKEGAMI HIROSHI;WAKI KAZUYOSHI;HONDA HIROSHI;TAKII TAKAAKI
分类号
H01L21/82;G06F17/50
主分类号
H01L21/82
代理机构
代理人
主权项
地址
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