| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive resin composition for a flexible printed wiring board, which shows no swelling or the like in appearance, and can secure sufficient adhesive strength even when a heat roll method is employed; a film-like adhesive; the flexible printed wiring board with a reinforcing plate using the same; and a manufacturing method therefor. <P>SOLUTION: The adhesive resin composition for the flexible printed wiring board contains (A) an acrylic polymer A having a weight average molecular weight (Mw) of 100,000 or more but less than 900,000, (B) an acrylic polymer B having a weight average molecular weight (Mw) of 1,000-80,000, (C) an epoxy resin and (D) a curing agent. The ratio (A:B) by mass of the content of the acrylic polymer A and the acrylic polymer B is preferably 100:1 to 100:20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
