| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device, in which a post-process for cutting an overflow part generated on resin molding processing can be skipped. <P>SOLUTION: The electronic device 10 includes a casing 20 formed of a substantially box-shape by a first casing member 23 and a second casing member 24. A panel 40 is arranged along a boundary between the first casing member 23 and the second casing member 24. The panel 40 includes a plurality of gates 42 and welds 43 between the respective gates 42 for resin molding, and an overflow tab 41 provided on the weld 43 is housed in the casing 20. Accordingly, the post-process for cutting the overflow tab 41 after the resin molding can be skipped, thereby reducing steps. <P>COPYRIGHT: (C)2013,JPO&INPIT |
