发明名称 |
Semiconductor Device Having a Bonding Pad and Method of Manufacturing The Same |
摘要 |
A semiconductor device including a device substrate having a front side and a back side. The semiconductor device further includes an interconnect structure disposed on the front side of the device substrate, the interconnect structure having a n-number of metal layers. The semiconductor device also includes a bonding pad disposed on the back side of the device substrate, the bonding pad extending through the interconnect structure and directly contacting the nth metal layer of the n-number of metal layers.
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申请公布号 |
US2012292730(A1) |
申请公布日期 |
2012.11.22 |
申请号 |
US201113112755 |
申请日期 |
2011.05.20 |
申请人 |
TSAI SHUANG-JI;YAUNG DUN-NIAN;LIU JEN-CHENG;LIN JENG-SHYAN;WANG WEN-DE;LIN YUEH-CHIOU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI SHUANG-JI;YAUNG DUN-NIAN;LIU JEN-CHENG;LIN JENG-SHYAN;WANG WEN-DE;LIN YUEH-CHIOU |
分类号 |
H01L27/146;H01L31/0224;H01L31/18 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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