| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing yield of a semiconductor package. <P>SOLUTION: A degate method for separating unnecessary resin such as a molding runner 91 connected by a workpiece W from the workpiece W including a lens 86 by transfer molding includes a step (a) for clamping the workpiece W except a portion, to which the unnecessary resin such as the molding runner 91 is connected, from upward and downward, into a condition that the unnecessary resin such as the molding runner 91 is floated; and a step (b) for continuing to press the unnecessary resin such as the molding runner 91 under a floated condition from one side to the other side in an upward and downward direction, and cutting down the unnecessary resin such as the molding runner 91 from the workpiece W. <P>COPYRIGHT: (C)2013,JPO&INPIT |
