| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for processing a wafer in which no cut waste adheres to a surface of the wafer when cutting an outer circumference of the wafer. <P>SOLUTION: A processing method for cutting a wafer which has a chamfering part 23 in its outer circumference and on which a plurality of devices are formed on its surface is thinned to a prescribed thickness comprises: a chamfering part removal step of rotating a chuck table 10 to cut an outer peripheral edge of the wafer and removing a chambering part in a region extending from the surface of the wafer at least to the prescribed thickness while cutting a cutting blade 16 into the outer peripheral edge of the wafer at least to the prescribed thickness; a protective member arrangement step of arranging the protective member on the surface of the wafer after performing the chamfering part removal step; and a grinding step of thinning the wafer to the prescribed thickness by grinding the rear surface of the wafer after performing the protective member arrangement step. The chamfering part removal step removes the chamfering part while supplying a cleaning liquid from above the central part of the wafer to the surface of the wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
