| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a thinner and readily peelable polyamide-imide film excellent in heat resistance, surface smoothness, optical characteristics and transparency, efficiently in good yield, because more excellent heat resistance, transparency and optical characteristics are requested for a film to be used in electric/electronic member, optical device member, etc., as electronic information equipment or the like advances toward reduction in size and weight and/or high functionalization. <P>SOLUTION: The method for producing a polyamide-imide film employing a polyamide-imide resin B1 as a raw material comprises: using a metal laminate in which a polyamide-imide resin A1 is laminated on a part or whole of a metal material; applying the polyamide-imide resin B1 on the site where the polyamide-imide resin is laminated; drying into a film form; and peeling only the film off the metal laminate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
