发明名称 INTELLIGENT DOUBLE-INTERFACE CARD AND WELDING PACKAGING TECHNOLOGY THEREOF
摘要 <p>Disclosed is an intelligent double-interface card. The intelligent double-interface card comprises a card base, an antenna and a chip. A welding spot of the antenna of the intelligent double-interface card is embedded in the card base through a first conductive welding material, the chip is heat-sealed on the card base through an adhesive, and a pin of the chip is electrically connected to a second conductive welding material embedded in the card base, and the second conductive welding material is electrically connected with the antenna through the first conductive welding material. Bottom surfaces of the first and second conductive welding materials are electrically connected through a conductive connection board embedded in the card base. In the present invention, the antenna is not required to be picked out to be welded with the pin on the chip, so the problem of breaking the antenna is completely avoided. According to the present invention, by filling the conductive welding material in auxiliary holes, the welding of the antenna, the conductive welding material and the chip as well as the welding of the chip base plate and the card base can be completed on the same equipment, in the same workstation and by using the same welding head in a manner of heating, therefore, the production rate as well as the production yield and quality are enhanced dramatically.</p>
申请公布号 WO2012155307(A1) 申请公布日期 2012.11.22
申请号 WO2011CN01506 申请日期 2011.09.05
申请人 ESIM TECHNOLOGY LTD.;WANG, JUNFENG;ZHANG, YAOHUA;HU, XIBIN;WANG, JIAN;ZHANG, CHENG;MENG, JIANFU 发明人 WANG, JUNFENG;ZHANG, YAOHUA;HU, XIBIN;WANG, JIAN;ZHANG, CHENG;MENG, JIANFU
分类号 G06K19/077 主分类号 G06K19/077
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