发明名称 |
Chemical mechanical polishing pad having a low defect window |
摘要 |
A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad. |
申请公布号 |
US2012295442(A1) |
申请公布日期 |
2012.11.22 |
申请号 |
US201213563137 |
申请日期 |
2012.07.31 |
申请人 |
KULP MARY JO;WILLIAMS SHANNON HOLLY;ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
KULP MARY JO;WILLIAMS SHANNON HOLLY |
分类号 |
H01L21/306;B44C1/22 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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