| 摘要 |
The present invention is to provide an optical subassembly with a co-axial package that enables to sense the temperature of the devices mounted within the subassembly with a relatively inexpensive chip thermistor. The subassembly includes a co-axial package and a FPC board to connect the subassembly to the outer circuit. The thermistor is mounted on the FPC board such that one electrode thereof is connected to a pattern formed on a surface opposite to a surface facing the subassembly and the other electrode is soldered to a via hole connecting two surfaces of the FPC board and this via hole is soldered directly to the subassembly. |
