| 摘要 |
<p>The chip processing plant (1) comprises a spraying unit (10) for spraying of chipboard articles with a liquid, and a drying unit (810) for drying the sprayed chipboard articles. The drying unit comprises hot air spraying agent for applying the sprayed chipboard articles with heated air. A separating unit is provided for separating the thermal insulation chips from the sprayed chipboard articles. The drying unit and the separating unit are configured as a drying strainer (80). An independent claim is included for a method for processing chipboard articles to thermal insulation chips.</p> |
