发明名称 Integrated micro-electro-mechanical systems (MEMS) sensor device
摘要 An integrated sensor device is provided. The integrated sensor device comprises a first substrate including a surface portion and a second substrate coupled to the surface portion of the first substrate in a stacked configuration, wherein a cavity is defined between the first substrate and the second substrate. The integrated sensor device also comprises one or more micro-electro-mechanical systems (MEMS) sensors located at least partially in the first substrate, wherein the MEMS sensor communicates with the cavity. The integrated sensor device further comprises one or more additional sensors.
申请公布号 US8315793(B2) 申请公布日期 2012.11.20
申请号 US20090477667 申请日期 2009.06.03
申请人 WITHANAWASAM LAKSHMAN;HONEYWELL INTERNATIONAL INC. 发明人 WITHANAWASAM LAKSHMAN
分类号 G01P15/00;G01C9/00;G01C21/10 主分类号 G01P15/00
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