Novel Epoxy Resin and Epoxy Resin Composite for Semiconductor Encapsulant,申请号KR20110023975-传众专利搜索

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发明名称	Novel Epoxy Resin and Epoxy Resin Composite for Semiconductor Encapsulant
摘要
申请公布号	KR101202028(B1)	申请公布日期	2012.11.16
申请号	KR20110023975	申请日期	2011.03.17
申请人		发明人
分类号	C08G59/02;C08K3/22;C08K3/36;C08L63/00	主分类号	C08G59/02
代理机构		代理人
主权项
地址

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