发明名称 |
HIGH TEMPERATURE ELECTROSTATIC CHUCK WITH RADIAL THERMAL CHOKES |
摘要 |
A wafer support assembly including a wafer support and cooling plate with radial thermal chokes is provided. The cooling plate and wafer support may have limited contact and may not contact each other outside of certain limited thermal contact patches. The thermal contact patches may generally define one or more radial thermal choke regions. In some implementations, high- and low-temperature cooling systems may be placed at one or more locations across the cooling plate to assist in temperature management. |
申请公布号 |
US2012285658(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
US201213467861 |
申请日期 |
2012.05.09 |
申请人 |
ROY SHAMBHU N.;BURKHART VINCENT E.;FIELDS SCOTT J. |
发明人 |
ROY SHAMBHU N.;BURKHART VINCENT E.;FIELDS SCOTT J. |
分类号 |
F28F9/007 |
主分类号 |
F28F9/007 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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