| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent deterioration of isolation and an increase of transmission loss. <P>SOLUTION: A high frequency device includes: a plurality of flat ground lead pins 25a that are formed projectedly from a die pad 30 in a peripheral part of the die pad on a surface of a substrate 10; a ground line 22a; a signal line 21e; and a plurality of flat signal lead pins 26a with their one end connected to one end of the signal line. An interval of a center line of the signal lead pin and a center line of the ground lead pin adjacent to the signal lead pin in their length direction in their respective end portions close to the die pad is narrower than 500 μm. At one end of the signal lead pin, the rear surface of the signal lead pin, except for a part thereof connected to the signal line, is removed by a predetermined thickness so as to reduce the thickness of the signal lead pin, thereby forming a defective part between the signal lead pin and the surface of the substrate. The one end of the signal lead pin and the signal line, and the ground lead pin and the ground line are respectively connected by soldering. <P>COPYRIGHT: (C)2013,JPO&INPIT |
