发明名称 Robust FEBOL and UBM Structure of C4 Interconnects
摘要 An electrical conductor is connected to a first microcircuit element having a first connector site axis and a second microcircuit having a second connector site axis. The first microcircuit and the second microcircuit are separated by and operatively associated with a first electrical insulator layer. The conductor and the first microcircuit element are separated by and operatively associated with a second electrical insulator layer. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric material. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric, decouples the UBM and solder connection to the FBEOL via opening. This eliminates or minimizes electromigration and the white bump problems. A process comprises manufacturing the microcircuit.
申请公布号 US2012286433(A1) 申请公布日期 2012.11.15
申请号 US201213478076 申请日期 2012.05.22
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LU MINHUA;PEFECTO ERIC D.;QUESTAD DAVID L.;RAY SUDIPTA K.
分类号 H01L23/488;H01L21/60 主分类号 H01L23/488
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