| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: an electronic component mounting package with high reliability; and an electronic device using the same. <P>SOLUTION: An electronic component mounting package includes: a substrate 1 having an electronic component mounting section 1a disposed on an upper surface of the substrate, and a through hole 1b extended between the upper surface and a lower surface of the substrate; a sealing material 2 loaded in the through hole 1b; and an upper end that protrudes upward from the upper surface of the substrate 1, and a lower end that protrudes downward from the lower surface of the substrate 1. The upper end and the lower end extend through the sealing material 2, and are fixed to the substrate 1. The electronic component mounting package includes terminals 3 configured to electrically connect electronic components therethrough. The sealing material 2 includes a recess 2a formed so as to surround the terminals 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
