Al-BASED ALLOY SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an Al-based alloy sputtering target capable of increasing a deposition rate (sputter rate) when a sputtering target is used, and preferably capable of preventing the occurrence of splashes.

SOLUTION: The Al-based alloy sputtering target includes Ta. In the Al-based alloy sputtering target, an Al-Ta-based intermetallic compound including Al and Ta preferably has a mean particle diameter of 0.005 μm or more and 1.0 μm or less, and a mean inter-particle distance of 0.01 μm or more and 10.0 μm or less.

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