发明名称 |
SEMICONDUCTOR DEVICE, CAMERA MODULE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
A semiconductor device is provided which has a semiconductor element having an element forming surface at which a sensor element is formed, a back surface on the opposite side of the element forming surface, and a light transmissive protective member laminated over the element forming surface via an adhering portion. The semiconductor device includes a region exposed from the protective member at the outer peripheral end portion of the semiconductor element, when viewed from the protecting member in a laminating direction.
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申请公布号 |
US2012286385(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
US201213555259 |
申请日期 |
2012.07.23 |
申请人 |
YAMADA SHIGERU;LAPIS SEMICONDUCTOR CO., LTD. |
发明人 |
YAMADA SHIGERU |
分类号 |
H01L31/0203;H01L27/14;H01L31/0232;H04N5/335 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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