| 发明名称 |
ANISOTROPIC CONDUCTIVE CONNECTION MATERIAL, FILM LAMINATE, CONNECTION METHOD, AND CONNECTION STRUCTURE |
| 摘要 |
<p>To improve connection strength and conduction reliability. This anisotropic conductive connection material is obtained by dispersing conductive particles (5) in an adhesive (4). The adhesive (4) contains a film-forming material, an acrylic resin, an organic peroxide and an amine compound, and the amine compound is a cyclic tertiary amine compound.</p> |
| 申请公布号 |
WO2012153849(A1) |
申请公布日期 |
2012.11.15 |
| 申请号 |
WO2012JP62194 |
申请日期 |
2012.05.11 |
| 申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORPORATION;AKUTSU, YASUSHI |
发明人 |
AKUTSU, YASUSHI |
| 分类号 |
C09J201/00;C09J4/02;C09J7/02;C09J9/02;C09J11/04;C09J11/06;H01B1/20;H01B5/16;H01R11/01 |
主分类号 |
C09J201/00 |
| 代理机构 |
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