发明名称 |
METHOD FOR CLEANING A SEMICONDUCTOR WAFER |
摘要 |
A wafer cleaning method includes: (1) providing a wafer cleaning apparatus comprising a sponge for scrubbing a surface of a semiconductor wafer to be cleaned; (2) implementing a pre-conditioning flow to pre-condition the sponge using a dummy wafer; and (3) performing a regular cleaning flow to scrub the surface of the semiconductor wafer to be cleaned using the pre-conditioned sponge. The dummy wafer has a plurality of upward protruding features on a surface of the dummy wafer for removing residual fibers or unwanted substances from the sponge. |
申请公布号 |
US2012285484(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
US201113106869 |
申请日期 |
2011.05.13 |
申请人 |
LIU LI-CHUNG;CHEN YI-NAN;LIU HSIEN-WEN |
发明人 |
LIU LI-CHUNG;CHEN YI-NAN;LIU HSIEN-WEN |
分类号 |
B08B1/00 |
主分类号 |
B08B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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