| 摘要 |
<p>The present invention is a method for inspecting a minute defect present in a translucent board-like body, while transferring the translucent board-like body along a transfer path. The method for inspecting a minute defect of a transparent board-like body has: a preliminary inspection step, wherein the position of the minute defect is specified by irradiating the translucent board-like body with light and picking up an image of the main surface of the translucent board-like body by means of a preliminary image pickup unit, said minute defect being present in the surface direction of the main surface of the translucent board-like body; and a detail inspection step, wherein, corresponding to the minute defect position obtained in the preliminary inspection step, a main image pickup unit is moved in the direction, which is along the surface of the translucent board-like body and intersects the transfer direction of the translucent board-like body, and the image of the minute defect is picked up, while moving the main image pickup unit in the transfer direction in the state wherein the main image pickup unit is aligned with the minute defect.</p> |
