发明名称 VACUUM VAPOR DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus capable of preventing a substrate from being contaminated by a solvent to obtain a high quality vapor deposition film by performing vapor deposition after reliably removing the solvent from a liquid material in which a deposition material is dissolved in the solvent. <P>SOLUTION: A vacuum vapor deposition apparatus 1 removes an organic solvent from an organic liquid material L in an evaporation device 2, then evaporates the organic liquid material L into an evaporated material, and introduces and deposits the evaporated material onto a substrate K in a vacuum vessel 4. The evaporation device 2 includes: an evaporation vessel 20 that is filled with the organic liquid material L and has an exhaust port 22 for an evaporated solvent formed therein; a heater 18 for evaporation that can be set to a temperature at which only the organic solvent is evaporated and no deposited material is evaporated; a vacuum pump 15 for an evaporation chamber connected with the exhaust port 22 via a second on-off valve 12; and a flow rate adjustment valve 16. The evaporation device 2 closes the flow rate adjustment valve 16 to evaporate only the organic solvent in the evaporation vessel 20 by the heater 18 for evaporation, and then opens the second on-off valve 12 to suction the evaporated solvent in the evaporation vessel 20 by the pump 15, allowing the organic solvent to be removed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012226838(A) 申请公布日期 2012.11.15
申请号 JP20110090543 申请日期 2011.04.15
申请人 HITACHI ZOSEN CORP 发明人 NODA TAKESHI
分类号 H05B33/10;C23C14/24;H01L51/50 主分类号 H05B33/10
代理机构 代理人
主权项
地址