发明名称 Semiconductor device and method for manufacturing the same
摘要 A semiconductor device includes a semiconductor layer, a first diffused region formed in the semiconductor layer, a second diffused region formed in the first diffused region, a trench formed in the semiconductor layer, a gate electrode disposed in the trench, a top surface of the gate electrode being lower than a top surface of the semiconductor layer and sagging downwards in a center thereof, a non-doped silicate glass film disposed in the trench and formed over the gate electrode, a top surface of the silicate glass film sagging downwards in a center thereof, an oxide film disposed in the trench and formed over the non-doped silicate glass film, a top surface of the oxide film sagging downwards in a center, and a source electrode formed over the semiconductor layer so that the source electrode contacts the first and second diffusion regions, and the oxide film at the top surface thereof.
申请公布号 US8310005(B2) 申请公布日期 2012.11.13
申请号 US201113317781 申请日期 2011.10.28
申请人 MURASE YOSHIMITSU;KOBAYASHI KENYA;YAMAMOTO HIDEO;KANEKO ATSUSHI;RENESAS ELECTRONICS CORPORATION 发明人 MURASE YOSHIMITSU;KOBAYASHI KENYA;YAMAMOTO HIDEO;KANEKO ATSUSHI
分类号 H01L29/78 主分类号 H01L29/78
代理机构 代理人
主权项
地址