| 摘要 |
PURPOSE: A PCB(Printed Circuit Board) manufacturing method is provided to eliminate a releasing film by spraying adhesion paste on the releasing film. CONSTITUTION: A PCB(100) includes a first insulation layer(110), an internal circuit pattern(121), an external circuit pattern(175), and a cover-layer(180). The internal circuit pattern is formed on the upper surface and lower surface of the first insulation layer. The external circuit pattern is composed of a second and a third insulation layer(160,165). A plurality of electronic components(200) is mounted in the PCB. The first or the third insulation layer forms an insulation plate. The first or the third insulation layer is composed of a thermoplasticity high polymer board, a ceramic board, an organic and inorganic complex board, or a glass fiber impregnation board. |
