发明名称 |
Light emitting diode package and fabrication method thereof |
摘要 |
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer. |
申请公布号 |
US8310023(B2) |
申请公布日期 |
2012.11.13 |
申请号 |
US20090360444 |
申请日期 |
2009.01.27 |
申请人 |
PARK HO JOON;HWANG WOONG LIN;CHOI SEOG MOON;LEE SUNG JUN;CHOI SANG HYUN;LIM CHANG HYUN;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK HO JOON;HWANG WOONG LIN;CHOI SEOG MOON;LEE SUNG JUN;CHOI SANG HYUN;LIM CHANG HYUN |
分类号 |
H01L23/52;H01L33/44;H01L33/58;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|